Nouveauté Connecteurs D-Sub haute densité
EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.
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EDAC Communication Interconnect SolutionsIdeal for data centers, communication nodes, phone systems, and smart building IoT applications.01.10.2024
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Amphenol Connecteurs Sub-D conformes à insertion par pressionConçus pour faciliter l'assemblage, la protection de la carte et la fiabilité à long terme.30.01.2024 -
EDAC Medical Interconnect SolutionsA comprehensive range of connectors and cable assemblies designed for medical applications.16.05.2023 -
EDAC Agricultural Technology Interconnect SolutionsOffers reliable and durable connector solutions that can withstand harsh agricultural environments16.05.2023 -
NorComp Solder Cup High-Density D-Sub ConnectorsProvide EMI/RFI shielding in 3 clinch-nut options and come in 4 industry sizes/positions.19.12.2022 -
NorComp Telematic Connector SolutionsOffers exceptional reliability and superior protection against moisture with an IP67 rating.30.06.2022