Multiprotokoll-Module

Ergebnisse: 1.633
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Serie Frequenz Ausgangsleistung Schnittstellen-Typ Versorgungsspannung - Min. Versorgungsspannung - Max. Minimale Betriebstemperatur Maximale Betriebstemperatur Antennenanschlusstyp Abmessungen Protokoll – Bluetooth, BLE – 802.15.1 Protokoll – Mobilfunk, NBIoT, LTE Protokoll – GPS, GLONASS Protokoll – Sub-GHz Protokoll – WLAN – 802.11 Protokoll – ANT, Thread, Zigbee – 802.15.4 Qualifikation Verpackung
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800erwartet ab 01.01.2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800erwartet ab 01.01.2027
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Multiprotokoll-Module RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
500erwartet ab 11.12.2026
Min.: 1
Mult.: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250erwartet ab 12.10.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module M.2 card with MAYA-W3 Wi-Fi 6E, Bluetooth module
140erwartet ab 25.12.2026
Min.: 1
Mult.: 1

MAYA-W3 GPIO, I2C, SDIO, UART Tray
u-blox Multiprotokoll-Module M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140erwartet ab 25.12.2026
Min.: 1
Mult.: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
u-blox Multiprotokoll-Module IW611, 802.11ax+BT, 2 antenna pins
1.000erwartet ab 19.08.2026
Min.: 1
Mult.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
1.000erwartet ab 25.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, U.FL conn, NXP610
1.000erwartet ab 25.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, embedded antenna
1.000erwartet ab 25.12.2026
Min.: 1
Mult.: 1
: 500

MAYA-W4 2.402 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
Texas Instruments Multiprotokoll-Module SimpleLink multipro tocol 2.4-GHz wirele
1.900erwartet ab 01.10.2026
Min.: 1
Mult.: 1
: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Multiprotokoll-Module SimpleLink multipro tocol 2.4-GHz wirele
1.968erwartet ab 03.09.2026
Min.: 1
Mult.: 1
: 2.000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.000erwartet ab 23.10.2026
Min.: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.070erwartet ab 26.08.2026
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
2.860erwartet ab 04.09.2026
Min.: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
200erwartet ab 19.08.2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotokoll-Module 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
200erwartet ab 20.08.2026
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Murata Electronics Multiprotokoll-Module Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
999erwartet ab 24.02.2027
Min.: 1
Mult.: 1
: 1.000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN Reel, Cut Tape
Telit Cinterion Multiprotokoll-Module
387erwartet ab 27.08.2026
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Digi Multiprotokoll-Module Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM
25erwartet ab 31.08.2026
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists Multiprotokoll-Module 2GF M.2 Module
45erwartet ab 30.10.2026
Min.: 1
Mult.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Embedded Artists Multiprotokoll-Module 2FY M.2 Module
49Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk
Intel BE200.NGWG.NVX
Intel Multiprotokoll-Module Intel Killer Wi-Fi 7 BE1750 x, 2230, 2x2 BE+BT, No vPro
100erwartet ab 24.08.2026
Min.: 1
Mult.: 1

BE200