ulTIMiFlux™ Thermal Interface Materials

Wakefield Thermal ulTIMiFlux™ Thermal Material offers high performance, cost-effectiveness, configurability, and custom sizes for thermal system needs. Thermal Interface Material (TIM) is a secondary material installed between the heat sink and the device and is designed to improve the thermal transfer to the heat sink. The Wakefield Thermal line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The ulTIMiFlux material utilizes a polyimide film to act as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective drop-in-place solution that makes an excellent replacement for thermal greases.