UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Ergebnisse: 40
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Serie
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 14.09.2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 07.09.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 12.10.2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
22erwartet ab 09.11.2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 21.09.2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 07.10.2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
22erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 19.10.2026
Min.: 1
Mult.: 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
Datenblatt
25erwartet ab 20.10.2026
Min.: 1
Mult.: 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
25erwartet ab 14.09.2026
Min.: 1
Mult.: 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 350
Mult.: 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6