Modules multiprotocoles

Résultats: 247
Sélectionner Image Référence
 Fab.
Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité.
Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole - Sous-Ghz
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Conditionnement
Sierra Wireless Modules multiprotocoles 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
Fiche technique
199En stock
Min. : 1
Mult. : 1

USB 3.135 V 4.4 V Tray
Embedded Artists Modules multiprotocoles 2LL M.2 Module
Fiche technique
39En stock
Min. : 1
Mult. : 1

UART 3.3 V 3.46 V - 40 C + 85 C U.FL Bluetooth WiFi Bulk
u-blox Modules multiprotocoles M.2 card with JODY-W263, in tray
Fiche technique
195En stock
Min. : 1
Mult. : 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray

Silicon Labs Modules multiprotocoles Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm
Fiche technique
1.310En stock
Min. : 1
Mult. : 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Microchip Technology Modules multiprotocoles ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Fiche technique
2.225En stock
Min. : 1
Mult. : 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
u-blox Modules multiprotocoles M.2 card with MAYA-W161, in tray
Fiche technique
277En stock
Min. : 1
Mult. : 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray
Inventek Modules multiprotocoles 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Fiche technique
213En stock
Min. : 1
Mult. : 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray

Espressif Systems Modules multiprotocoles SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C
Fiche technique
2.501En stock
650Sur commande
Min. : 1
Mult. : 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Ezurio Modules multiprotocoles 60 Series, Sterling Module w/u.FL, PCIE/UART
Fiche technique
195En stock
Min. : 1
Mult. : 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Espressif Systems Modules multiprotocoles SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.
Fiche technique
Plus d'infos disponibles

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Silex Technology Modules multiprotocoles [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo
Fiche technique
7En stock
Min. : 1
Mult. : 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Embedded Artists Modules multiprotocoles 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM
Fiche technique
51En stock
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Pulse Electronics Modules multiprotocoles USB 802.11 b/g/n BT module
746En stock
Min. : 1
Mult. : 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Modules multiprotocoles [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Fiche technique
10En stock
Min. : 1
Mult. : 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
CEL Modules multiprotocoles CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Fiche technique
2En stock
Min. : 1
Mult. : 1

CMP9670 PCIe, USB Bluetooth Bulk
Microchip Technology Modules multiprotocoles ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Fiche technique
130En stock
Min. : 1
Mult. : 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Adafruit Modules multiprotocoles ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna 10En stock
Min. : 1
Mult. : 1

Bulk
Ezurio Modules multiprotocoles Module, Sterling LWB+, M.2, Key E, SDIO, UART
Fiche technique
59En stock
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Microchip Technology Modules multiprotocoles ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna
Fiche technique
815En stock
Min. : 1
Mult. : 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Silicon Labs Modules multiprotocoles MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Fiche technique
260En stock
Min. : 1
Mult. : 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Telit Cinterion Modules multiprotocoles 339En stock
Min. : 1
Mult. : 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion Modules multiprotocoles 392En stock
Min. : 1
Mult. : 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
InnoPhase IoT Modules multiprotocoles WiFi/BLE5/MCU Module w/ PCB Antenna
Fiche technique
385En stock
Min. : 1
Mult. : 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Silicon Labs Modules multiprotocoles 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Fiche technique
772En stock
Min. : 1
Mult. : 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Telit Cinterion Modules multiprotocoles 181En stock
39229/06/2026 attendu
Min. : 1
Mult. : 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Tray