OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 SiPs

Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 System-in-Packages (SiPs) are a fast, flexible way to develop a system around the AMD Xilinx® Zynq® UltraScale+™ MPSoC. These SiPs allow users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSZU3 SiPs integrate the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, with 2GB (16GB) LPDDR4, power management, and other required components into a single BGA package. This integration reduces design effort by months, allowing users to get to market faster or spend time adding more features to products.

Résultats: 4
Sélectionner Image Référence
 Fab.
Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité.
Qté. RoHS Modèle de ECAO Série
Facteur de forme
Type de processeur
Capacité maximale de RAM
Tension d'alimentation de fonctionnement
Type d'interface
Température de fonctionnement min.
Température de fonctionnement max.
Dimensions
Conditionnement
Octavo Systems Systèmes sur modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C
Fiche technique
10En stock
Min. : 1
Mult. : 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
Octavo Systems Systèmes sur modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
Fiche technique
620/02/2026 attendu
Min. : 1
Mult. : 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Systèmes sur modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
Fiche technique
316/02/2026 attendu
Min. : 1
Mult. : 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Systèmes sur modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
Fiche technique
320/04/2026 attendu
Min. : 1
Mult. : 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray