Octavo Systems OSD32MP2 System-in-Package (SiP) Modules

Octavo Systems OSD32MP2 System-in-Package (SiP) Modules feature the OSD32MP2 and OSD32MP2-PM innovative SiP modules designed for industrial automation and consumer electronic applications. The SiP modules integrate the STMicroelectronics STM32MP25 processors, which allow unparalleled processing power with excellent connectivity and robust security functions. The OSD32MP2 family also provides DDR4 memory, STMPMIC2 power management, EEPROM, oscillators, and passives in the module design. The OSD32MP2 offers a 21mm x 21mm BGA package, and the OSD32MP2-PM provides a more compact 9mm x 14mm BGA package, ideal for space-constrained applications. The Octavo Systems OSD32MP2 SiP Modules with the STM32MP25 processor have dual Arm® Cortex®-A35 cores, an Arm Cortex-M33 core, a 3D GPU supporting Vulkan API, H.264 video encoding/decoding, a 1.35 TOPS AI accelerator, and comprehensive connectivity options. These modules require high-performance processing and advanced graphics.