Molex Impress Co-Packaged Copper Solutions
Molex Impress Co-Packaged Copper Solutions are compression-based on-substrate connectors and mating cable assemblies that deliver near-ASIC connectivity at 224Gbps PAM‑4 and beyond. Molex Impress Co-Packaged Copper Solutions feature a compact, durable socket that simplifies maintenance. The socket design also future-proofs high-density artificial intelligence (AI) and hyperscale data center architectures.
Features
- Compression-based on-substrate connector and cable assembly
- Optimizes signal integrity and efficient power distribution
- 224Gbps PAM-4 speeds and beyond
- Leverages insights and engineering expertise from NearStack OTS
- Compact footprint and enhanced durability
- Simplifies maintenance
- Upgrades to future-proof high-density systems
Applications
- 224G applications
- AI and machine-learning systems
- High-performance computing systems
- Hyperscale data centers
Specifications
- 92Ω impedance
- 0.5A maximum current per DP
- 50V maximum voltage
- 35mΩ contact resistance
- 250V dielectric withstanding voltage
- 100MΩ insulation resistance
- Circuit sizes
- Banks of 32 DPs up to 128 or 512 DPs
- Banks of 64 DPs up to 256 or 1024 DPs (in development)
- -40°C to +85°C operating temperature range
Application Examples
Publié le: 2026-02-20
| Mis à jour le: 2026-02-20