Ambiq Apollo330 Plus Ultra-Low Power Systems-on-Chips

Ambiq Apollo330 Plus Ultra-Low Power Systems-on-Chips (SoC) are engineered to deliver high‑performance edge and Artificial Intelligence (AI) computing while dramatically reducing power consumption. The Ambiq Apollo330 Plus SoCs are ideal for next‑generation battery‑powered and always‑on devices. Built on Ambiq’s Subthreshold Power Optimized Technology (SPOT®), the Apollo330 Plus family integrates an Arm® Cortex®‑M55 processor (running up to 250 MHz with Helium™ vector extensions) to accelerate AI inferencing at the edge with exceptional efficiency. These devices also feature a dedicated Arm Cortex‑M4F network processor for low‑power wireless communication, with variants supporting BLUETOOTH® Low Energy, Thread, and Matter. This architectural combination allows devices to perform more complex on‑device AI tasks, maintain long battery life, and enable real‑time responsiveness in edge applications.

The Apollo330 Plus SoC series offers enhanced memory performance with over 2MB of system RAM, 2MB of embedded non‑volatile memory, sizable instruction and data caches, and a rich suite of peripherals, including advanced sensor interfaces and an ultra‑low‑power digital microphone for truly always‑on voice capabilities. Designed for body‑worn, ambient, smart home, healthcare, and industrial edge environments, the Apollo330 Plus series provides robust hardware‑based security through secureSPOT® and TrustZone® technologies, enabling secure boot, firmware updates, and data protection. Overall, the Apollo330 Plus platform empowers manufacturers to build intelligent, responsive, and energy‑efficient products that leverage local AI processing without relying heavily on the cloud.

Features

  • Up to 250MHz Arm Cortex-M55 application processor with turboSPOT® and Helium technology for high-performing AI at the edge
  • 48/96MHz Arm Cortex-M4F network coprocessor
  • Ultra-low active and sleep power enabled by Ambiq's Sub-threshold Power Optimized Technology (SPOT) platform, which helps edge devices maximize battery footprints
  • Enhanced memory performance with 32kB I-cache and 32kB D-cache, over 2MB of system RAm and 2MB of embedded non-volatile memory for code/data
  • Enables always-on and real-time AI right from the device, enhancing security, improving robustness, and minimizing energy consumption
  • Ultra-low-power digital microphone PDM for truly always-on voice
  • Adds support for Bluetooth Low Energy 5.4, while the Apollo330M further extends the series with multi-protocol radio support for IEEE 802.15.4, Thread, and Matter
  • Wide range of integrated sensor interfaces, including ADC, SPI, I2C, I3C, and UART
  • Multiple packages and connectivity options for diverse endpoints

Applications

  • Healthcare devices
  • Smart home and smart building devices
  • Industrial edge applications
  • Body‑worn AI devices
  • Ambient AI devices
  • Conventional edge AI systems
  • Wireless Internet of Things (IoT) devices

Specifications

  • 96MHz SoC frequency, 250MHz turboSPOT
  • 32-bit Arm Cortex-M55 with Helium technology, network coprocessor, and DMA
  • 2MB NVM
  • 2MB SRAM
  • 1.71V to 3.63V range
  • 12-bit, 11-channel, and up to 2.8MS/s sampling rate ADC
  • 2x UART
  • I/O
    • 6x I2C/SPI masters
    • 1x full duplex I2C/SPI slave
    • USB 2.0 FS/HS
    • 2x SDIO (v3.0)/eMMC
  • MSPI master
    • 1/2/4-bit wide (2x) up to 96MT/s (SDR/DDR)
    • 1/2/4/8/16-bit wide (1x) up to 250MT/s (SDR/DDR)
  • 1x I2S master/slave full-duplex
  • Audio
    • 1x PDM stereo DMIC interface
    • PLL for precision audio
  • secureSPOT 3.0 Arm Trustzone security
  • Connectivity
    • AP330BPA-CCR - Bluetooth Low Energy 5.4
    • AP330MPA-CCR - Bluetooth Low Energy 5.4, Bluetooth Classic, 802.15.4, Thread, and Matter
  • -95/-98/-104dBm RF sensitivity (2Mbps/1Mbps/125kbps)
  • Up to +14dBm Tx output power
  • Package options
    • 5.3mm x 5.3mm BGA with 120x GPIO
    • 4.0mm x 4.0mm CSP with 68x GPIO

Block Diagram

Block Diagram - Ambiq Apollo330 Plus Ultra-Low Power Systems-on-Chips
Publié le: 2026-02-18 | Mis à jour le: 2026-02-19