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HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP
- NRF54LV10A-CAAA-R7
- Nordic Semiconductor
-
1.500:
1,42 €
-
1.500erwartet ab 08.02.2027
-
Neues Produkt
|
Mouser-Teilenr.
949-NRF54LV10ACAAAR7
Neues Produkt
|
Nordic Semiconductor
|
HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP
|
|
1.500erwartet ab 08.02.2027
|
|
Min.: 1
Mult.: 1
|
|
|
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HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN
- NRF54LV10A-QFAA-R
- Nordic Semiconductor
-
3.000:
1,56 €
-
3.000erwartet ab 08.02.2027
-
Neues Produkt
|
Mouser-Teilenr.
949-NRF54LV10AQFAA-R
Neues Produkt
|
Nordic Semiconductor
|
HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN
|
|
3.000erwartet ab 08.02.2027
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN
- NRF54LV10A-QFAA-R7
- Nordic Semiconductor
-
1.000:
1,61 €
-
1.000erwartet ab 08.02.2027
-
Neues Produkt
|
Mouser-Teilenr.
949-NRF54LV10AQFAAR7
Neues Produkt
|
Nordic Semiconductor
|
HF-System auf einem Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN
|
|
1.000erwartet ab 08.02.2027
|
|
Min.: 1
Mult.: 1
|
|
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Bluetooth-Module – 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
Fanstel BM05M
- BM05M
- Fanstel
-
1:
5,09 €
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
308-BM05M
Neues Produkt
|
Fanstel
|
Bluetooth-Module – 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 1
Mult.: 1
:
1.000
|
|
|
|
|
HF-System auf einem Chip - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee
Nordic Semiconductor NRF54LC10A-QFAA-R7
- NRF54LC10A-QFAA-R7
- Nordic Semiconductor
-
1.000:
1,61 €
-
1.000erwartet ab 08.02.2027
-
Neues Produkt
|
Mouser-Teilenr.
949-NRF54LC10AQFAAR7
Neues Produkt
|
Nordic Semiconductor
|
HF-System auf einem Chip - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee
|
|
1.000erwartet ab 08.02.2027
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Multiprotokoll-Module Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
- IM-100-MHF
- Silex Technology
-
500:
27,59 €
-
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
Mouser-Teilenr.
702-IM-100-MHF
|
Silex Technology
|
Multiprotokoll-Module Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
|
|
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
- IM-100-MHF-SP
- Silex Technology
-
1:
37,39 €
-
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
Mouser-Teilenr.
702-IM-100-MHF-SP
|
Silex Technology
|
Multiprotokoll-Module IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
|
|
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Multiprotokoll-Module the option to attach an antenna via a trace. does not include the u.Fl connector
- IM-100-PAD
- Silex Technology
-
500:
27,59 €
-
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
Mouser-Teilenr.
702-IM-100-PAD
|
Silex Technology
|
Multiprotokoll-Module the option to attach an antenna via a trace. does not include the u.Fl connector
|
|
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module the option to attach an antenna via a trace does not include the u.Fl connector
- IM-100-PAD-SP
- Silex Technology
-
1:
37,39 €
-
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
Mouser-Teilenr.
702-IM-100-PAD-SP
|
Silex Technology
|
Multiprotokoll-Module the option to attach an antenna via a trace does not include the u.Fl connector
|
|
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
Bluetooth-Module – 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105?
- HCM213SABMD-1X-01
- Quectel
-
500:
5,83 €
-
Nicht-auf-Lager-Vorlaufzeit 18 Wochen Beschränkte Verfügbarkeit
-
Neues Produkt
|
Mouser-Teilenr.
277-HCM213SABMD-1X01
Neues Produkt
|
Quectel
|
Bluetooth-Module – 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105?
|
|
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
- KCMA32SAAMD-0P
- Quectel
-
500:
5,44 €
-
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277-KCMA32SAAMD-0P
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
|
|
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
- KCMA32SAAMD-1X
- Quectel
-
500:
5,48 €
-
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277-KCMA32SAAMD-1X
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
|
|
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
- KCMA32SABMD-0P
- Quectel
-
1.000:
6,37 €
-
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277-KCMA32SABMD-0P
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
|
|
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
|
|
Min.: 1.000
Mult.: 1.000
:
1.000
|
|
|
|
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
- KCMA32SABMD-1X
- Quectel
-
1.000:
6,49 €
-
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277-KCMA32SABMD-1X
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
|
|
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
|
|
Min.: 1.000
Mult.: 1.000
:
1.000
|
|
|
|
|
Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
- FCM363XABMD-4X-08
- Quectel
-
500:
11,53 €
-
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277FCM363XABMD4X08
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
|
|
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
- FCM363XACMD-0P-08
- Quectel
-
500:
13,52 €
-
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
277FCM363XACMD0P08
Neues Produkt
|
Quectel
|
Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
|
|
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|