-ar Modules multiprotocoles

Résultats: 197
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Série Fréquence Alimentation en sortie Type d'interface Tension d’alimentation - Min. Tension d’alimentation - Max. Température de fonctionnement min. Température de fonctionnement max. Type de connecteur d'antenne Dimensions Protocole : Bluetooth, BLE - 802.15.1 Protocole - Cellulaire, NBIoT, LTE Protocole - GPS, GLONASS Protocole - Sous-Ghz Protocole : Wi-Fi - 802.11 Protocole : ANT, Thread, Zigbee - 802.15.4 Conditionnement
Quectel Modules multiprotocoles Cat M1 Only, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency) 154En stock
Min. : 1
Mult. : 1
Bobine: 250

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Modules multiprotocoles Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY! 374En stock
Min. : 1
Mult. : 1
Bobine: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Modules multiprotocoles Cat M1/Cat NB2, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency) 240En stock
Min. : 1
Mult. : 1
Bobine: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Modules multiprotocoles Cat M1/Cat NB2/EGPRS, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency) 97En stock
50025/05/2026 attendu
Min. : 1
Mult. : 1
Bobine: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Modules multiprotocoles Embedded, 0-6000, Cable assembly, 150mm, -, SMA-female to IPEX MHFI 10En stock
Min. : 1
Mult. : 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel Modules multiprotocoles Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1En stock
Min. : 1
Mult. : 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel Modules multiprotocoles Embedded, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 25 25 4 2En stock
Min. : 1
Mult. : 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS
Fanstel Modules multiprotocoles BLE 5.1 nRF52833 DF U.FL Connector
2.704Sur commande
Min. : 1
Mult. : 1
Bobine: 1.000

BM833 2.4 GHz 8 dBm I2C, I2S, SPI, UART 1.7 V 5.5 V - 40 C + 105 C u.FL 10.2 mm x 15 mm x 1.9 mm Bluetooth 5.1 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Quectel Modules multiprotocoles Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE 84En stock
Min. : 1
Mult. : 1
Bobine: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Texas Instruments Modules multiprotocoles SimpleLink multipro tocol 2.4-GHz wirele
3.99206/07/2026 attendu
Min. : 1
Mult. : 1
Bobine: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
CEL Modules multiprotocoles ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3En stock
Min. : 1
Mult. : 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Quectel Modules multiprotocoles Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 34En stock
Min. : 1
Mult. : 1
Bobine: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
25014/08/2026 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
25020/08/2026 attendu
Min. : 1
Mult. : 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
25014/08/2026 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Embedded Artists Modules multiprotocoles 2GF M.2 Module
2102/03/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Microchip Technology Modules multiprotocoles Bluetooth Low Energy/Zigbee Combo Module with PCB Antenna and extended temperature
14424/07/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics Modules multiprotocoles Type 2FR module
97513/10/2026 attendu
Min. : 1
Mult. : 1
Bobine: 1.000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Silicon Labs Modules multiprotocoles 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified Délai de livraison produit non stocké 12 Semaines
Min. : 2.500
Mult. : 2.500
Bobine: 2.500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists Modules multiprotocoles 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
Délai de livraison produit non stocké 10 Semaines
Min. : 1.000
Mult. : 1

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Embedded Artists Modules multiprotocoles 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA Délai de livraison produit non stocké 8 Semaines
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs Modules multiprotocoles Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Délai de livraison produit non stocké 12 Semaines
Min. : 1.000
Mult. : 1.000
Bobine: 1.000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel
Silicon Labs Modules multiprotocoles Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Délai de livraison produit non stocké 12 Semaines
Min. : 1
Mult. : 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Ezurio Modules multiprotocoles Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip, Trace Pin Délai de livraison produit non stocké 16 Semaines
Min. : 1
Mult. : 1
Bobine: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this Délai de livraison produit non stocké 6 Semaines
Min. : 1
Mult. : 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel