3.3 V Modules multiprotocoles

Résultats: 194
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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Qualification
Conditionnement
Ezurio Modules multiprotocoles Module, Sona IF573, MIMO, MHF4, Cut Tape
Fiche technique
246En stock
Min. : 1
Mult. : 1

Sona IF573 2.4 GHz, 5 GHz, 6 GHz UART 3.13 V 3.47 V - 40 C + 85 C Bluetooth Core 6.0, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Cut Tape
Ezurio Modules multiprotocoles BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Trace pin (Cut Tape)
Fiche technique
128En stock
Min. : 1
Mult. : 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Modules multiprotocoles BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Cut Tape)
Fiche technique
246En stock
Min. : 1
Mult. : 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Microchip Technology Modules multiprotocoles ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Fiche technique
2.241En stock
Min. : 1
Mult. : 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Advantech Modules multiprotocoles 802.11ax+BT5.3, NXP 88W9098, PCIe-UART,
Fiche technique
215En stock
Min. : 1
Mult. : 1
AIW-165 2.4 GHz, 5 GHz UART 3.3 V 3.3 V - 40 C + 85 C Without Antenna 28 mm x 30 mm x 3.95 mm Bluetooth 5.3
AAEON UP Modules multiprotocoles Quectel 4G LTE CAT4 Global module EG-25G Mini PCIe with RF Cable 150mm and LTE Full band & GPS Antenna
Fiche technique
47En stock
Min. : 1
Mult. : 1

33 dBm PCIe, UART, USB 3.3 V 3.3 V - 40 C + 80 C u.FL 50 mm x 30 mm x 4.9 mm LTE GNSS Bulk

Ezurio Modules multiprotocoles 2.4GHz + 5GHz WiFi AC module + BT5.0
Fiche technique
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 70 C u.FL 13 mm x 18 mm Bluetooth 4.1 802.11 a/b/g/n/ac
Ezurio Modules multiprotocoles Sterling LWB+, Chip Antenna, CutTape
Fiche technique
1.154En stock
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Ezurio Modules multiprotocoles Module, Sterling LWB5+, Chip Antenna
Fiche technique
640En stock
Min. : 1
Mult. : 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Advantech Modules multiprotocoles AX210 6E 802.11ax+BT5.2 vpo module+anten
Fiche technique
290En stock
Min. : 1
Mult. : 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
7En stock
Min. : 1
Mult. : 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Silex Technology Modules multiprotocoles [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Fiche technique
15En stock
Min. : 1
Mult. : 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Pulse Electronics Modules multiprotocoles USB 802.11 b/g/n BT module
746En stock
Min. : 1
Mult. : 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Ezurio Modules multiprotocoles Sterling LWB+, MHF4, Cut Tape
Fiche technique
38En stock
20024/11/2026 attendu
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Espressif Systems Modules multiprotocoles SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Fiche technique
851En stock
3.25014/07/2026 attendu
Min. : 1
Mult. : 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Modules multiprotocoles SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Fiche technique
3.080En stock
Min. : 1
Mult. : 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
STMicroelectronics Modules multiprotocoles NB-IoT module with extra ADC. Supported LTE FDD frequency bands: B1, B3, B5, B8, B20, B2
Fiche technique
467En stock
MouseReel disponible
Min. : 1
Mult. : 1
: 800

ST67W 2.412 GHz to 2.484 GHz 10 dBm SPI, UART 2.97 V 3.63 V - 40 C + 85 C RF Bluetooth WiFi Reel, Cut Tape, MouseReel
Silex Technology Modules multiprotocoles 2x2 Dual Band 802.11 ac WLAN+BT PCIe
Fiche technique
87En stock
10103/08/2026 attendu
Min. : 1
Mult. : 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Modules multiprotocoles [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Fiche technique
75En stock
678Sur commande
Min. : 1
Mult. : 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Sierra Wireless Modules multiprotocoles 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
Fiche technique
131En stock
20022/07/2026 attendu
Min. : 1
Mult. : 1

USB 3.135 V 4.4 V Tray

Murata Electronics Modules multiprotocoles Type 1LD Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.2
845En stock
Min. : 1
Mult. : 1
: 1.000

1LD 2.4 GHz 17 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C External 8.9 mm x 7.8 mm x 1.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac AWS Reel, Cut Tape
Quectel Modules multiprotocoles Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, voice + data application, North America, mPCIe form factor
Fiche technique
103En stock
Min. : 1
Mult. : 1
: 100

824 MHz to 960 MHz, 1.561 GHz, 1.57542 GHz, 1.71 GHz to 2.69 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Silex Technology Modules multiprotocoles [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
Fiche technique
12En stock
81Sur commande
Min. : 1
Mult. : 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Modules multiprotocoles Type A USB Connector Sample Piece
Fiche technique
14En stock
Min. : 1
Mult. : 1

SX-USBAC 2.4 GHz, 5 GHz USB 3.135 V 3.465 V - 20 C + 85 C MHF1 22 mm x 21 mm x 2.75 mm 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac Bulk
Quectel Modules multiprotocoles Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, voice + data application, North America, mPCIe form factor
Fiche technique
79En stock
Min. : 1
Mult. : 1

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray