Modules multiprotocoles

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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole - Sous-Ghz
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Qualification
Conditionnement
Intel Modules multiprotocoles Intel Wi-Fi 6 AX201 (Gig+), 1216, 2x2 AX+BT, vPro
Fiche technique
755En stock
Min. : 1
Mult. : 1

Wi-Fi 6 AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 802.11 ax
Ezurio Modules multiprotocoles BLE module BL653 (Nordic nRF52833) Trace pin (Tape/Reel)
Fiche technique
807En stock
Min. : 1
Mult. : 1
: 1.000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Reel, Cut Tape
Texas Instruments Modules multiprotocoles TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1835MODGBMOCR
Fiche technique
287En stock
MouseReel disponible
Min. : 1
Mult. : 1
: 250

WL1835MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Silicon Labs Modules multiprotocoles MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Fiche technique
380En stock
Min. : 1
Mult. : 1
: 1.000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Ezurio Modules multiprotocoles 60 Series, Sterling Module w/u.FL, PCIE/UART
Fiche technique
195En stock
Min. : 1
Mult. : 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Ezurio Modules multiprotocoles Module, Sterling LWB5+, Chip Antenna
Fiche technique
614En stock
Min. : 1
Mult. : 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Texas Instruments Modules multiprotocoles TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1831MODGBMOCT
Fiche technique
1.292En stock
MouseReel disponible
Min. : 1
Mult. : 1
: 1.200

WL1831MOD 2.4 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 20 C + 70 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel

Silicon Labs Modules multiprotocoles Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module
Fiche technique
761En stock
Min. : 1
Mult. : 1

MGM13P 2.4 GHz 10 dBm I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C Built-In 12.9 mm x 17.8 mm x 2.3 mm Bluetooth Thread, Zigbee Cut Tape
Advantech Modules multiprotocoles AX210 6E 802.11ax+BT5.2 vpo module+anten
Fiche technique
290En stock
Min. : 1
Mult. : 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Silex Technology Modules multiprotocoles [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo
Fiche technique
7En stock
Min. : 1
Mult. : 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Espressif Systems Modules multiprotocoles SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector, -40C - +105C
Fiche technique
3.306En stock
Min. : 1
Mult. : 1
: 6.500
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Reel, Cut Tape
Espressif Systems Modules multiprotocoles SMD module, ESP32-PICO-V3 with 4MB flash die inside, ESP32 ECO V3, PCB antenna, for Alexa Connect Kit (ACK).
Fiche technique
Commentaire Produit
477En stock
Min. : 1
Mult. : 1
: 650

ESP32 2.4 GHz 19.5 dBm GPIO, I2C, I2S, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 16 mm x 23 mm x 2.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
Murata Electronics Modules multiprotocoles Type 1XL Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Fiche technique
1.830En stock
Min. : 1
Mult. : 1
: 1.000

1XL 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UART 1.71 V 3.46 V - 40 C + 60 C Without Antenna 19.1 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Embedded Artists Modules multiprotocoles 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM
Fiche technique
51En stock
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Intel AX211.NGWG
Intel Modules multiprotocoles Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, vPro
Fiche technique
467En stock
Min. : 1
Mult. : 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Intel AX210.NGWG.NVX
Intel Modules multiprotocoles Intel Killer Wi-Fi 6E AX1675 x (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 143En stock
30029/06/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Intel AX210.D2WG.NV
Intel Modules multiprotocoles Intel Wi-Fi 6E AX210 (Gig+), 1216, 2x2 AX R2 (6GHz)+BT, No vPro
Fiche technique
790En stock
MouseReel disponible
Min. : 1
Mult. : 1
: 1.000

Wi-Fi 6 AX210 6 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.67 mm Bluetooth 5.3 802.11 ax Reel, Cut Tape, MouseReel
Intel AX210.NGWGIE.NV99ARN4
Intel Modules multiprotocoles Intel Wi-Fi 6E AX210 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, Embedded, No vPro 272En stock
Min. : 1
Mult. : 1

Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
2En stock
Min. : 1
Mult. : 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Intel Modules multiprotocoles Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Fiche technique
28En stock
Min. : 1
Mult. : 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
5En stock
Min. : 1
Mult. : 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel Modules multiprotocoles Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
Fiche technique
67En stock
Min. : 1
Mult. : 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Advantech Modules multiprotocoles Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
Fiche technique
1En stock
413/07/2026 attendu
Min. : 1
Mult. : 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 BLE 5.3 802.11 b/g/n/ac/ax/be, WiFi 7
Pulse Electronics Modules multiprotocoles USB 802.11 b/g/n BT module
746En stock
Min. : 1
Mult. : 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
CEL Modules multiprotocoles CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Fiche technique
2En stock
Min. : 1
Mult. : 1

CMP9670 PCIe, USB Bluetooth Bulk