Test & Burn-In Sockets Supports CI et composants

Résultats: 102
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Produit Nombre de positions Nombre de lignes Type Pas Style du raccordement Dépôt par contact Espacement des lignes Température de fonctionnement min. Température de fonctionnement max. Série Conditionnement
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,48P EVEN RW,W/O THRML PN 16En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 48 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
Aries Electronics Supports CI et composants FORCE DIP TEST SCKT HIGH TEMP 24 PINS 1En stock
2015/09/2026 attendu
Min. : 1
Mult. : 1

Test & Burn-In Sockets 24 Position 2 Row ZIF DIP 2.54 mm Solder Tail Nickel Boron 15.24 mm - 65 C + 200 C X55X
Yamaichi Electronics Supports CI et composants 216 PIN QFP, 0.40 MM
Test & Burn-In Sockets 216 Position QFP Socket 0.4 mm Through Hole Gold IC51
3M Electronic Solutions Division Supports CI et composants Textool QFN .4MM,48P EVEN ROW,W/THRML PI 6En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 48 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 3 Contact Qty. 27En stock
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 3 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 3 Contact Qty. 67En stock
Min. : 1
Mult. : 1
Test & Burn-In Sockets 3 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 4 Contact Qty. 14En stock
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 4 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,64P EVEN ROW,W/THRML PI 38En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 64 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each


Aries Electronics Supports CI et composants 225 PIN PGA GOLD 19En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 225 Position PGA ZIF 2.54 mm Solder Tail Gold - 65 C + 125 C PRS
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,24P EVEN ROW,W/THRML PI 21En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 24 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants Textool QFN .4MM,56P EVEN ROW,W/THRML PI 6En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
Aries Electronics Supports CI et composants SOCKET 3En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 441 Position 21 Row PGA ZIF 2.54 mm Solder Tail Gold 2.54 mm - 65 C + 125 C PRS
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 8 Leads 43En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 14 Leads 1En stock
2003/09/2026 attendu
Min. : 1
Mult. : 1

Test & Burn-In Sockets 14 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,16P EVEN ROW,W/THRML PI 6En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 16 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 16 Leads 26En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 20 Leads 16En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 20 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 24 Leads 18En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 24 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 28 Leads 15En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 28 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Bulk
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,40P EVEN RW,W/O THRML PN 12En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 40 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants Textool QFN .5MM,48P EVEN ROW,W/THRML PIN 3En stock
3501/10/2026 attendu
Min. : 1
Mult. : 1

Test & Burn-In Sockets 48 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 4 Contact Qty. 65En stock
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 4 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 3 Contact Qty. 35En stock
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 3 Position Laser Diode Socket 2 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 4P NO FLANGE 52En stock
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 4 Position Laser Diode Socket 2 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division 203-6970-50-0602J
3M Electronic Solutions Division Supports CI et composants LASER DIODE SOCKET 3 Contact Qty. 46En stock
20021/09/2026 attendu
Min. : 1
Mult. : 1
Non
Test & Burn-In Sockets 3 Position Laser Diode Socket 2 mm Solder Gold - 55 C + 125 C Each