+ 150 C Supports CI et composants

Résultats: 87
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Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité.
Qté. RoHS Modèle de ECAO Produit
Nombre de positions
Nombre de lignes
Type
Pas
Style du raccordement
Dépôt par contact
Espacement des lignes
Température de fonctionnement min.
Température de fonctionnement max.
Série
Conditionnement
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 18 Leads
Fiche technique
52En stock
Min. : 1
Mult. : 1

18 Position Solder Tail Gold - 55 C + 150 C Each
Aries Electronics Supports CI et composants QUICK RELEASE 40 PIN GOLD
Fiche technique
8En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X57X
Yamaichi Electronics Supports CI et composants Open Top Sckt - QFP 48 P Cnt, 0.5 Pitch
Fiche technique

QFP Sockets 48 Position Socket 0.5 mm Through Hole Gold - 40 C + 150 C IC357
Yamaichi Electronics Supports CI et composants 20 PIN TSOP 0.65 MM
Fiche technique

SOP Sockets 20 Position Chip Carrier 0.65 mm SMD/SMT Gold - 40 C + 150 C IC51
Yamaichi Electronics Supports CI et composants 28 Pin SOP 1.27mm Pitch
Fiche technique

SOP Sockets 28 Position 1.27 mm SMD/SMT Gold - 40 C + 150 C IC189
Yamaichi Electronics Supports CI et composants 16 PIN TSOP 0.65 MM PITCH
Fiche technique

SOP Sockets 16 Position Chip Carrier 0.65 mm SMD/SMT Gold - 40 C + 150 C IC51 Bulk
Aries Electronics Supports CI et composants QUICK RELEASE 24 PIN GOLD
Fiche technique
19En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 24 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 150 C X57X
Aries Electronics Supports CI et composants QUICK RELEASE 28 PIN GOLD
Fiche technique
20En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X57X
Aries Electronics Supports CI et composants QUICK RELEASE 32 PIN GOLD
Fiche technique
16En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 32 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X57X
Yamaichi Electronics Supports CI et composants 16 PIN SOP 1.27 MM PITCH
Fiche technique

SOP Sockets 16 Position Chip Carrier 1.27 mm SMD/SMT Gold - 40 C + 150 C IC51 Bulk
Yamaichi Electronics Supports CI et composants 64 PIN QFP 0.80 MM PITCH

QFP Sockets 64 Position Open Frame 0.8 mm SMD/SMT Gold - 40 C + 150 C IC234
Aries Electronics Supports CI et composants DIP TEST SCKT GOLD 48 PINS
Fiche technique
24En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 48 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
Yamaichi Electronics Supports CI et composants 8 PIN SOP 1.27 MM
Fiche technique

SOP Sockets 8 Position Chip Carrier 1.27 mm SMD/SMT Gold - 40 C + 150 C IC51
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 28 Leads
Fiche technique
18En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 28 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Bulk
Yamaichi Electronics Supports CI et composants 16 PIN SOP 1.27 MM
Fiche technique

SOP Sockets 16 Position Chip Carrier 1.27 mm SMD/SMT Gold - 40 C + 150 C IC51
Yamaichi Electronics Supports CI et composants 100P QFP .5MM PITCH W/O POSITIONER PIN

QFP Sockets 100 Position 0.5 mm SMD/SMT Gold - 40 C + 150 C IC234 Bulk
3M Electronic Solutions Division Supports CI et composants RECPT FOR DIP SOCKET 28 Contact Qty.
Fiche technique
39En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 28 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants HOLE PLUGS FOR PGA SET OF 10
Fiche technique
475En stock
Min. : 1
Mult. : 1
Non
Accessories Hole Plug - 55 C + 150 C
Aries Electronics Supports CI et composants 28 PIN W/HANDLE
Fiche technique
118En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X


Aries Electronics Supports CI et composants 48 PIN W/HANDLE
Fiche technique
93En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 48 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
3M Electronic Solutions Division Supports CI et composants RECPT FOR DIP SOCKET 14 Contact Qty.
Fiche technique
19En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 14 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
Aries Electronics Supports CI et composants 32 PIN W/HANDLE
Fiche technique
55En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 32 Position 2 Row DIP Header 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
Aries Electronics Supports CI et composants 40 PIN W/HANDLE 1
Fiche technique
21En stock
Min. : 1
Mult. : 1

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Tail Gold 15.24 mm - 65 C + 150 C X55X
3M Electronic Solutions Division Supports CI et composants POWER IN-LINE SOCKET 3contact, 1 piece
Fiche technique
65En stock
8011/05/2026 attendu
Min. : 1
Mult. : 1

Transistor Sockets 3 Position 2 Row Discrete Power In-Line 5.94 mm Solder Gold 8.23 mm - 55 C + 150 C Each
3M Electronic Solutions Division Supports CI et composants BURN-IN SOIC SOCKET 8 Leads
Fiche technique
48En stock
Min. : 1
Mult. : 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each