High-Performance Passive Coolers

Advanced Thermal Solutions High-Performance Passive Coolers are designed for CPUs and other high-powered processors that fit the Intel™ LGA2011 square and LGA2066 sockets (Socket R). These straightFlN heat sinks feature optimized fin designs to cover a wide range of requirements as well as an optional standard backing plate to accommodate the cooling of any high-powered device. ATS High-Performance Passive Coolers promote a true 1U design, making them ideal for 1U systems with open airflow front to back. These coolers are available in a blue anodized finish with aluminum fins to reduce weight or in a nickel-plated finish with copper fins to reduce spreading resistance.

Résultats: 4
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Produit Conçu pour Style de montage Matériau du dissipateur thermique Longueur Largeur Hauteur
Advanced Thermal Solutions Dissipateurs Ultra Cool CPU Heat Sink, Fanless, Aluminum, 90x90x28mm, 0.79 R@1m/s 33En stock
Min. : 1
Mult. : 1

Heat Sinks LGA2011, LGA2066 Screw Aluminum 90 mm 90 mm 28 mm
Advanced Thermal Solutions Dissipateurs Ultra Cool CPU Heat Sink, Fanless, Nickel Plate, Copper, 90x90x28mm, 0.69 R@1m/s
9527/02/2026 attendu
Min. : 1
Mult. : 1

Heat Sinks LGA2011, LGA2066 Screw Copper 90 mm 90 mm 28 mm
Advanced Thermal Solutions Dissipateurs Ultra Cool CPU Heat Sink, Fanless, Aluminum, 90x90x28mm, 0.74 R@1m/s 132Stock usine disponible
Min. : 100
Mult. : 5

Heat Sinks LGA2011, LGA2066 Screw Aluminum 90 mm 90 mm 28 mm
Advanced Thermal Solutions Dissipateurs Ultra Cool CPU Heat Sink, Fanless, Nickel Plate, Copper, 90x90x28mm, 0.57 R@1m/s 245Stock usine disponible
Min. : 100
Mult. : 5

Heat Sinks LGA2011, LGA2066 Screw Copper 90 mm 90 mm 28 mm