Amphenol Aerospace High Density HDB³ and HSB³ Connectors

Amphenol Aerospace High Density HDB³ and HSB³ Connectors incorporate a higher density contact pattern and lower mated height than Amphenol's standard low mating force rectangular brush connectors. HDB³ connectors utilize the same durable and reliable B³ brush contact in a tighter 0.070" x 0.060" staggered grid pattern. The HSB³ series allows data rates up to 6.250Gb/s via 100Ω matched impedance differential pairs. Applications for Amphenol Aerospace High Density HDB³ and HSB³ Connectors are transportation, medical equipment, military and commercial avionics, C4ISR, UAVs, naval, high-definition cameras, and harsh environments.


  • Higher density contact pattern
  • Uses less board space
  • Allows for shorter mated height
  • Provides the durability and performance of the brush contact


  • Transportation
  • Medical equipment
  • Military and commercial avionics
  • C4ISR
  • UAVs
  • Naval
  • High-definition cameras
  • Harsh environments


  • Polarization: D-shaped design
  • Up to 6.25Gbps HDB³ data rates
  • Optional keys offer 36 unique keying combinations
  • Optional guide pins provide additional alignment
  • Capable of correcting up to a 020" initial radial misalignment
  • Capable of mating with up to a 2° initial angular misalignment
  • 100,000 mating cycles
  • 1.5oz insertion/extraction force typical per contact
  • -65°C to +125°C operating temperature range
  • Current rating: 2A hot-swap 1A maximum (load dependent)
  • 5GΩ minimum insulation resistance
Publié le: 2015-02-26 | Mis à jour le: 2022-06-22